Processor
Processor Family
11th Generation Intel® Core™ i3 / i5 Processor
Processor**[1]
Core i3-1115GRE | 2 | 4 | 1.7GHz | 6MB | DDR4-3200 | Intel UHD Graphics |
Core i5-1145GRE | 4 | 8 | 1.1GHz | 8MB | DDR4-3200 | Intel Iris® Xe Graphics |
Notes:
- Intel Turbo Boost is disabled on SE30. The maximum TDP of CPU is 12W. The max frequency is not obtainable at high work levels, the CPU will adjust the frequency to obtain the maximum TDP allowed.
Operating System
Operating System**
- Windows® 10 IoT Enterprise LTSC 2021
- Ubuntu Core
- Ubuntu Server
- No operating system
Graphics
Graphics**
Intel UHD graphics | Integrated | Shared | - | - | 1x HDMI® 1.4b, 1x USB-C®, 1x Thunderbolt™ | 3840x2160@30Hz(HDMI), 3840x2160@60Hz(USB-C), 3840x2160@60Hz(Thunderbolt) | DirectX® 12 | - |
Intel Iris Xe Graphics | Integrated | Shared | - | - | 1x DP 1.4a, 1x USB-C, 1x Thunderbolt | 3840x2160@60Hz(DP), 3840x2160@60Hz(USB-C), 3840x2160@60Hz(Thunderbolt) | DirectX 12 | - |
Monitor Support
Monitor Support
Supports up to 3 independent displays via onboard ports (i3 models supports HDMI, USB-C, and Thunderbolt; i5 models supports DisplayPort™, USB-C, and Thunderbolt)
Chipset
Chipset
Intel SoC (System on Chip) platform
Memory
Max Memory
- 8GB soldered memory, not upgradable
- 16GB soldered memory, not upgradable
Memory Slots
Memory soldered to systemboard, no slots, dual-channel
Memory Protection[1]
IB-ECC
Notes:
- IB-ECC needs to be enabled in BIOS
Storage
Storage Support[1]
Up to two drives, 2x M.2 2230 SSD
• M.2 2230 SSD up to 1TB each
• RAID 0/1 support
Storage Type***
M.2 2230 SSD | PCIe® NVMe®, PCIe 3.0 | - |
M.2 2230 SSD | PCIe NVMe, PCIe 3.0 | Opal |
Notes:
- The storage capacity supported is based on the test results with current Lenovo® storage offerings. The system may support larger storage as the technology develops.
- RAID preset is available via special bid, limited to the models with Windows 10 IoT Enterprise.
Power Supply
Power Supply
65W | Adapter | 89% | Autosensing |
No power supply | - | - | - |
Network
Ethernet
1x gigabit Ethernet (Realtek® RTL8111KI-CG) and 1x 2.5 gigabit Ethernet (Intel I225-IT), 2x RJ-45, supports Wake-on-LAN
WLAN + Bluetooth®**[1]
- Intel Wireless-AC 9260, 802.11ac Dual Band 2x2 Wi-Fi® + Bluetooth 5.0, Intel vPro® technology support, M.2 card
- Intel Wireless-AC 9260, 802.11ac Dual Band 2x2 Wi-Fi + Bluetooth 5.0, M.2 card
- No WLAN and Bluetooth
WWAN**
- Quectel EM160R-GL, Qualcomm® Snapdragon™ X24 LTE Modem, CAT16, M.2 card
- Qualcomm Snapdragon X55 5G Modem-RF System, Sub-6 GHz, M.2 card
- No support
Notes:
- Bluetooth 5.2 is hardware ready but may run at a lower version due to OS limitations.
Ports[1]
Front Ports
- 2x USB 3.2 Gen 2
- 1x USB-C 3.2 Gen 2 (support data transfer and display)
- 1x headphone / microphone combo jack (3.5mm)
- 2x serial (RS232 / RS422 / RS485, BIOS selectable)
Optional Front Ports***
- 2x gigabit Ethernet (RJ-45) on SE30 IO box
- 2x serial (RS232 / RS422 / RS485, SDK selectable) on SE30 IO box
Rear Ports[2]
- 1x Thunderbolt 4 / USB4® 40Gbps (support data transfer, Power Delivery 5V@3A, and display)
- 1x HDMI 1.4b (for i3 models)
- 1x DisplayPort 1.4a (for i5 models)
- 1x USB 3.2 Gen 2
- 2x Ethernet (RJ-45)
- 1x power connector
Optional Rear Ports***
- 1x USB-C 3.2 Gen 1 on SE30 IO box, connect to SE30
- 1x DC-in 3pin Phoenix connector on SE30 IO box
- 1x DIO (4DI / 4DO) on SE30 IO box
Notes:
- The transfer speed of following ports will vary and, depending on many factors, such as the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment, will be slower than theoretical speed.
USB 2.0: 480 Mbit/s;
USB 3.2 Gen 1 (SuperSpeed USB 5Gbps, formerly USB 3.0 / USB 3.1 Gen 1): 5 Gbit/s;
USB 3.2 Gen 2 (SuperSpeed USB 10Gbps, formerly USB 3.1 Gen 2): 10 Gbit/s;
USB 3.2 Gen 2x2 (SuperSpeed USB 20Gbps): 20 Gbit/s;
Thunderbolt 3/4: 40 Gbit/s
- If IO box gets power supply from ThinkEdge SE30, need to connect USB-C (on IO box) with Thunderbolt 4 port (on SE30)
Monitor Cable
Monitor Cable***
- USB-C to DP dongle
- USB-C to HDMI dongle
- USB-C to VGA dongle
- DP to VGA dongle
- DP to Dual DP (MST) dongle
- DP to Dual DP (SST) dongle
- DP to HDMI 1.4 dongle
- No monitor cable
Security
Security Chip
Discrete TPM 2.0, TCG certified
Physical Locks
Kensington® Security Slot™, 3 x 7 mm
Chassis Intrusion Switch
Chassis intrusion switch
BIOS Security
- Self-healing BIOS
- Self-healing BIOS (EC-based)
Operating Environment[1]
Temperature
- Operating: IEC60068-2-1 Test A: Cold, IEC 60068-2-2 Test B: Dry heat, -20°C (-4°F) to 60°C (140°F) with 0.7 m/s air flow
- Storage: IEC60068-2-1 Test A: Cold, IEC 60068-2-2 Test B: Dry heat, -40°C (-40°F) to 85°C (185°F)
Humidity
- Relative humidity storage: IEC 60068-2-66 Damp heat, steady state 90%@60°C
- Relative humidity operating: IEC 60068-2-66 Damp heat, steady state 95%@40°C non-condensing
Shock Protection
IEC 60068-2-27, shock, operating, 30G / 11ms, half sine
Vibration Protection
IEC 60068-2-64, Vibration, Operating, 3Grms, random, 5 ~ 500Hz, 1hr/axis
Notes:
- The temperature spec is not applicable for hardware accessories.